EILM 2026 Announcement | MoveLink Technology × Southwest Jiaotong University Embodied Intelligence Joint Research Center Officially Inaugurated

July 10, 2026 — Chengdu, China

The Second International Conference on Embodied Intelligence and Large Models (EILM 2026) , jointly with the Inauguration Ceremony of the MoveLink Technology and Southwest Jiaotong University Embodied Intelligence Joint Research Center, officially opened today at Southwest Jiaotong University.

Hosted by Southwest Jiaotong University and organized by its School of Computing and Artificial Intelligence, with KDD China as co-organizer, EILM 2026 focuses on theoretical innovations, algorithmic breakthroughs, and industrial applications of embodied intelligence and large models. The conference brings together leading global experts for in-depth academic exchange, establishing itself as a premier international academic platform in the field of embodied intelligence.

At the opening ceremony, the Joint Research Center co-established by MoveLink Technology and Southwest Jiaotong University was officially inaugurated — marking a significant milestone in MoveLink's strategic advancement in embodied intelligence applications, transitioning from technological exploration to a new phase of integrated R&D and industrial deployment.

"This partnership with Southwest Jiaotong University will infuse strong research and talent vitality into our company, accelerating breakthroughs in key technological bottlenecks in semiconductor intelligent manufacturing, and solidifying our technological leadership and industrial value amidst the industry-wide intelligent upgrade," stated a company representative.

Academic Highlights

The academic program featured keynote presentations from several distinguished international scholars:

• Professor Pan Yi of Shenzhen University of Advanced Technology shared insights on large language model-enabled biomedical applications and future research directions.

• Professor Gang Wang of Kagoshima University (Japan) explored neural mechanisms of object recognition, discussing the intersection of neuroscience and artificial intelligence.

• Professor Xu Jie of the University of Leeds (UK) delivered in-depth analysis on large language model optimization, scaling efficiency, and AI agent system infrastructure.

The conference also included multiple oral presentation and poster sessions covering multi-modal perception, agent decision-making, industrial application scenarios, and other specialized research areas.

Strategic Collaboration

As a leading institution in artificial intelligence foundational theory, robotics technology, and embodied large models, Southwest Jiaotong University brings strong research capabilities and deep academic accumulation to the Joint Research Center, providing sustained academic support and technical reserves.

MoveLink Technology, as a leading semiconductor AMHS total solution and core equipment provider, has been continuously exploring the integrated application of intelligent perception, autonomous decision-making, and precision execution in semiconductor material handling scenarios. The company has established a trinity core capability system of "self-developed hardware and software – automation integration – localized services" , with mature engineering implementation and industrialization transformation capabilities — offering real-world industrial validation scenarios and efficient deployment pathways for cutting-edge technologies.

Future Outlook

The newly established Embodied Intelligence Joint Research Center fully integrates the complementary strengths of both parties, creating a complete innovation chain from fundamental research and key technology development to industrial implementation. The Center will focus on next-generation AI technologies, robotics, and embodied large models as core directions, conducting targeted R&D around semiconductor intelligent manufacturing scenarios to drive the industrialization of scientific and technological achievements and advance AMHS systems toward smarter, more flexible, and more reliable solutions.

Looking ahead, MoveLink Technology will leverage the Joint Research Center as a core vehicle to continue increasing R&D investment in embodied intelligence, deepen university-industry collaborative innovation mechanisms, accelerate cutting-edge technology deployment and core product development, and drive the deep implementation of embodied intelligence technologies in semiconductor manufacturing scenarios — contributing to the upgrading of semiconductor intelligent manufacturing and serving China's national intelligent manufacturing strategy.