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In today’s increasingly competitive semiconductor industry, backend packaging and testing (OSAT) has become a critical stage where production efficiency and the level of automation are emerging as key indicators of a company’s core competitiveness.
Previously, a well-known semiconductor packaging and testing factory faced significant bottlenecks in its Wire Bonding (WB) area, where material transport, machine loading/unloading, and storage relied heavily on manual operations. This led to chronic issues such as low efficiency, wasted space, and frequent human errors.
Now, powered by MoveLink’s intelligent manufacturing solutions for semiconductor production lines, the WB area has undergone a remarkable transformation—from a traditional manual workflow to a fully intelligent and automated production environment.
Before the Upgrade: Low Efficiency, Tight Space, and Limited Growth
The WB area of this factory covers more than 2,000 m² and houses hundreds of wire-bonding machines. However, prior to the upgrade, it faced several prominent issues:
• Material handling and loading/unloading:
Operations relied heavily on manual labor, resulting in high physical workload, low efficiency, and risks such as delayed loading and human error.
• Outdated storage methods:
WIP (Work-In-Process) was stored on traditional manual racks, which occupied large floor space and offered low storage density, consuming valuable production area.
• Capacity constraints:
As business demand continued to grow, the production line was approaching full capacity. Limitations in both efficiency and space gradually became the ceiling for future development.
After the Upgrade: Comprehensive Empowerment Through Intelligent Technologies
To break through bottlenecks and unleash production capacity, the factory partnered with MoveLink to systematically implement an intelligent manufacturing solution, carrying out a full transformation of the WB process area:
• Significant increase in storage density
By introducing intelligent stockers to replace traditional racks, storage density improved dramatically:
Floor space reduced by 40%
Inventory capacity increased by 35%
This enables more material to be stored within the same area, greatly easing spatial pressure.
• Replanning of functional zones, enabling simultaneous capacity expansion
The original WIP storage area was freed up, allowing space for additional equipment:
5% production capacity increase achieved
Output per unit area (space efficiency) improved significantly
• Intelligent equipment connection upgrade
Through the MoveLink-EAP control module, the system can precisely sense Load Port status and connect with machine states:
Automated docking between machines and hybrid AGVs
Improved loading/unloading efficiency and equipment utilization
• End-to-end logistics automation
Lifter + AGV:
Enables large-volume, cross-floor material transport and automated warehousing.
Hybrid AGV:
Handles material transfer and loading/unloading, seamlessly connecting with equipment to achieve closed-loop material flow.
Overall, labor reduction reached up to 80%.
Remarkable Results: The “Lights-Out Factory” — From Blueprint to Reality
The project has recently been successfully commissioned, marking the client’s official entry into a new era of lights-out manufacturing. With a highly automated system in place, the production line now operates stably around the clock with minimal or no on-site personnel:
Production capacity has increased significantly, with overall efficiency greatly improved
Labor costs have been substantially reduced, while material loss risks are minimized
Lean manufacturing capabilities continue to advance, helping the client maintain a leading position in a highly competitive market
MoveLink is proving through real action that intelligent manufacturing is not just a slogan—it is a transformation that is practical, measurable, and achievable.
Looking ahead, we will continue empowering more semiconductor factories, advancing toward a more efficient and more intelligent future for the industry.