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Application Scenarios
WIP ASRS for semiconductor production line
Applied to multiple process stages such as Probe, EOL, PBR and TEST in semiconductor AT cater for plants, realizing the temporary storage and turnover storage of WIP at the line edge, FOUP, Wafer CST, Metal Tray and other carriers
- It facilitates the adjustment of production line layout and the increase or decrease of AGV numbers, providing a more flexible solution
- Cater for multi scenarios and variuos carriers
- Realize automatic inbound and outbound interaction with IAR, AGV and other equipment
Applied to DA process, achieving wafer rings storage and sorting before DA, as well as and wafer rings recycling and storage of 8"/12" wafer rings after DA
- Improve storage density and storage at line edge
- Compatible with 8-inch and 12 inch wafer rings, capable of handling small batch wafer ring split and combined orders
- StockerASRS has the advantages of high precision, stability, and throughput
- Realize automatic inbound and outbound interaction with manual carts, IAR and other equipment
Based on Movelink's self-developed MCS system, import AGV+workstation mode for Die bank material input/output and storage
- High density inventory, maximizing storage density
- Compatible with 11 types of carriers, including 12 inch FOUP, Wafer Box, Coinstack, BNC, ect.
- Customize workstation design to reduce the intensity of personnel handling operations and achieve automated inbound and outbound warehousing
Applied to the WB-Mold process section, realizing the temporary storage and transfer of WIP before and after WB, cater for Magazine and Basket
- Improve storage density and capacity at line edge to save production line area
- Stocker ASRS has the advantages of high precision, stability, and throughput
- Realize automation and rapid manual input and output
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Phone number:
+86-28-6394-4976
E-mail:
info@movelink.com
Address:
Room 101, Unit 3, Building 3, No.600 Shuxin Avenue, High-Tech District, Chengdu, China
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